Barbara Will

City:

Herrenberg

Country:

Germany

Published Applications:

Last publication date:

2022-09-29

Top Assignees for applications by Barbara Will

The entities that hold a legal rights for patent applications filed by inventor Will Barbara:

Barbara Will from Herrenberg, DE has applied for patents for these inventions. The list has both pending applications and granted patents:

METHOD AND DEVICE FOR LOCALLY REMOVING AND/OR MODIFYING A POLYMER MATERIAL ON A SURFACE

Method for forming trenches in a semiconductor component

Single-phase converter module

Soldering method for mounting electric components

Semiconductor system having a pn transition and method for manufacturing a semiconductor system

InventorID:

3420110 ⎘