Inventor profile of:

Hans Krueger

City:

Munich

Country:

Germany

Published Applications:

20

Last publication date:

2014-04-24

Top Assignees for applications by Hans Krueger

The entities that hold a legal rights for patent applications filed by inventor Krueger Hans:

Recent patent applications by Krueger Hans

Hans Krueger from Munich, DE has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2014-04-24
US20140111062A1
Electricity

Wafer-level package and method for production thereof

#2 | 2013-08-22
US20130214405A1
Performing operations; transporting

Component and method for producing a component

#3 | 2013-06-06
US20130140656A1
Performing operations; transporting

MEMS microphone and method for producing the MEMS microphone

#4 | 2013-05-16
US20130119492A1
Performing operations; transporting

Miniaturized electrical component comprising an MEMS and an ASIC and production method

#5 | 2012-06-28
US20120159778A1
Electricity

Method for connecting a plurality of unpackaged substrates

#6 | 2012-03-15
US20120061778A1
Performing operations; transporting

Method and apparatus for producing chip devices, and chip device produced by means of the method

#7 | 2011-09-29
US20110233690A1
Physics

Semiconductor chip arrangement with sensor chip and manufacturing method

#8 | 2011-09-08
US20110214905A1
Electricity

Circuit board with flexible region and method for production thereof

#9 | 2011-08-04
US20110186943A1
Performing operations; transporting

MEMS package and method for the production thereof

#10 | 2011-05-19
US20110114355A1
Electricity

Hermetically sealed housing for electronic components and manufacturing method

#11 | 2010-07-29
US20100187949A1
Electricity

Component with reduced temperature response, and method for production

#12 | 2010-06-17
US20100148285A1
Electricity

MEMS component and method for production

#13 | 2010-05-27
US20100127377A1
Performing operations; transporting

Method for producing a MEMS package

#14 | 2009-06-30
US10484942
-

Method for hermetically encapsulating a component

#15 | 2009-04-23
US20090104415A1
Electricity

Element with optical marking, manufacturing method, and use

#16 | 2009-03-19
US20090071710A1
Electricity

Flip-chip component production method

#17 | 2009-01-01
US20090001553A1
Performing operations; transporting

MEMS package and method for the production thereof

#18 | 2008-02-28
US20080048317A1
Electricity

Electric component with a flip-chip construction

#19 | 2007-09-27
US20070222056A1
Electricity

Encapsulated electrical component and production method

#20 | 2006-07-13
US20060151203A1
Electricity

Encapsulated electronic component and production method

InventorID:

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