Chee-Way Oh

City:

Hsinchu

Country:

Taiwan

Published Applications:

Last publication date:

2011-08-04

Top Assignees for applications by Chee-Way Oh

The entities that hold a legal rights for patent applications filed by inventor Oh Chee-Way:

Chee-Way Oh from Hsinchu, TW has applied for patents for these inventions. The list has both pending applications and granted patents:

High frequency flip chip package structure of polymer substrate

High frequency flip chip package process of polymer substrate and structure thereof

InventorID:

3425296 ⎘