Freising
Germany
13
2011-08-04
The entities that hold a legal rights for patent applications filed by inventor LANGE Bernhard P.:
Bernhard P. LANGE from Freising, DE has applied for patents for these inventions. The list has both pending applications and granted patents:
Device and Method for Inert Gas Cure for Leadframe or Substrate Strips
#2 | 2010-07-01High power integrated circuit device having bump pads
#3 | 2010-01-28Multi lead frame power package
#4 | 2010-01-14Non-pull back pad package with an additional solder standoff
#5 | 2009-04-02Flip chip package with advanced electrical and thermal properties for high current designs
#6 | 2008-05-01Non-pull back pad package with an additional solder standoff
#7 | 2008-01-03Exposed top side copper leadframe manufacturing
#8 | 2007-12-20DUAL LEADFRAME SEMICONDUCTOR DEVICE PACKAGE
#9 | 2007-12-13Apparatus for Grinding a Wafer
#10 | 2007-12-13Semiconductor device with improved high current performance
#11 | 2007-11-29Design and Method for Attaching a Die to a Leadframe in a Semiconductor Device
#12 | 2006-08-24Flip chip package with advanced electrical and thermal properties for high current designs
#13 | 2006-07-27Mold cavity identification markings for IC packages
3427140 ⎘