Eagle, Idaho
United States
11
2011-11-24
The entities that hold a legal rights for patent applications filed by inventor Kirby Kyle:
Kyle Kirby from Eagle, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Method of forming temporary carrier structure and associated release techniques
#2 | 2011-10-06Semiconductor with through-substrate interconnect
#3 | 2011-09-29Through-wafer interconnects for photoimager and memory wafers
#4 | 2011-08-25Semiconductor substrates comprising through substrate interconnects that are visible on the substrate backside
#5 | 2010-07-08Through-wafer interconnects for photoimager and memory wafers
#6 | 2009-12-24Semiconductor with through-substrate interconnect
#7 | 2009-08-27Method for increasing etch rate during deep silicon dry etch
#8 | 2009-06-25Method of forming temporary carrier structure and associated release techniques
#9 | 2009-02-05System and method for providing semiconductor device features using a protective layer
#10 | 2008-12-04Method for increasing etch rate during deep silicon dry etch
#11 | 2008-05-15Through-wafer interconnects for photoimager and memory wafers
3430554 ⎘