PATRICK CLARK

City:

Orlando, Florida

Country:

United States

Published Applications:

Last publication date:

2011-09-29

Top Assignees for applications by PATRICK CLARK

The entities that hold a legal rights for patent applications filed by inventor CLARK PATRICK:

PATRICK CLARK from Orlando, US has applied for patents for these inventions. The list has both pending applications and granted patents:

Method for manufacturing 3D circuits from bare die or packaged IC chips by microdispensed interconnections

Method for manufacturing 3D circuits from bare die or packaged IC chips by microdispensed interconnections

InventorID:

3447805 ⎘