BRYAN IRWIN

City:

Winter Springs, Florida

Country:

United States

Published Applications:

Last publication date:

2011-09-29

Top Assignees for applications by BRYAN IRWIN

The entities that hold a legal rights for patent applications filed by inventor IRWIN BRYAN:

BRYAN IRWIN from Winter Springs, US has applied for patents for these inventions. The list has both pending applications and granted patents:

Method for manufacturing 3D circuits from bare die or packaged IC chips by microdispensed interconnections

Method for manufacturing 3D circuits from bare die or packaged IC chips by microdispensed interconnections

InventorID:

3447808 ⎘