Tokyo
Japan
9
2011-12-29
The entities that hold a legal rights for patent applications filed by inventor Kusunoki Junya:
Junya Kusunoki from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:
Temporary bonding adhesive for a semiconductor wafer and method for manufacturing a semiconductor device using the same
#2 | 2011-10-27TEMPORARY BONDING ADHESIVE FOR A SEMICONDUCTOR WAFER AND METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE USING THE SAME
#3 | 2010-05-13SEMICONDUCTOR DEVICE
#4 | 2009-09-10Method of manufacturing light receiving device
#5 | 2009-07-30Photosensitive compositions based on polycyclic polymers for low stress, high temperature films
#6 | 2009-01-08Light-Receiving Device
#7 | 2008-11-13Semiconductor device
#8 | 2008-04-17Semiconductor wafer and semiconductor device
#9 | 2006-01-26Photosensitive compositions based on polycyclic polymers for low stress, high temperature films
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