Robert Weinke

City:

München

Country:

Germany

Published Applications:

Last publication date:

2011-11-10

Top Assignees for applications by Robert Weinke

The entities that hold a legal rights for patent applications filed by inventor Weinke Robert:

SIEMENS AKTIENGESELLSCHAFT 5 Munich, Germany
SIEMENS AKTIENGESELLSCHAFT 1 Munchen, Germany

Recent patent applications by Weinke Robert

Robert Weinke from München, DE has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2011-11-10

US20110272826A1

Electricity

Electronic module and method for producing an electric functional layer on a substrate by blowing powder particles of an electrically conductive material

#2 | 2010-11-18

US20100289152A1

Electricity

Strip conductor structure for minimizing thermomechanical loads

#3 | 2010-08-19

US20100208438A1

Electricity

Method for contacting electronic components by means of a substrate plate

#4 | 2009-07-16

US20090179527A1

Electricity

Contacting multilayer piezo actuators or sensors

#5 | 2008-08-14

US20080191360A1

Electricity

Adhesive Strip Conductor on an Insulating Layer

#6 | 2008-07-10

US20080164616A1

Electricity

Strip Conductor Structure for Minimizing Thermomechanical Loads

#7 | 2008-06-05

US20080128710A1

Electricity

Producing SiC packs on a wafer plane

InventorID:

3471103 ⎘