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Inventor profile of:

Shigeru Kondou

City:

Osaka

Country:

Japan

Published Applications:

9

Last publication date:

2023-03-30

Top Assignees for applications by Shigeru Kondou

The entities that hold a legal rights for patent applications filed by inventor Kondou Shigeru:

PANASONIC CORPORATION 5 Osaka, Japan
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 2 Osaka, Japan
Panasonic Holdings Corporation 1 Osaka, Japan
TOYOTA JIDOSHA KABUSHIKI KAISHA 1 Aichi-ken, Japan

Recent patent applications by Kondou Shigeru

Shigeru Kondou from Osaka, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2023-03-30

US20230095738A1

METHOD FOR MANUFACTURING BATTERY, AND BATTERY

#2 | 2023-03-30

US20230095398A1

METHOD FOR PRODUCING BATTERY, AND BATTERY

#3 | 2011-11-17

US20110279996A1

Semiconductor assembly and multilayer wiring board

#4 | 2010-08-26

US20100213609A1

Solder bump, semiconductor chip, method of manufacturing the semiconductor chip, conductive connection structure, and method of manufacturing the conductive connection structure

#5 | 2010-04-08

US20100084762A1

Memory card

#6 | 2009-10-29

US20090267214A1

Electronic circuit device and method for manufacturing same

#7 | 2008-05-01

US20080102701A1

Connector with Shield, and Circuit Board Device

#8 | 2006-02-23

US20060038274A1

3D circuit module, multilayer 3D circuit module formed thereof, mobile terminal device using the circuit modules and method for manufacturing the circuit modules

#9 | 2005-11-24

US20050260867A1

Board connecting component and three-dimensional connecting structure using thereof

InventorID:

3476159 ⎘