Berkeley Heights, New Jersey
United States
52
2011-11-17
The entities that hold a legal rights for patent applications filed by inventor Geusic Joseph E.:
Joseph E. Geusic from Berkeley Heights, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Strained semiconductor by full wafer bonding
#2 | 2011-10-13METHOD OF FORMING CELLULAR MATERIAL
#3 | 2009-10-15LOW K INTERCONNECT DIELECTRIC USING SURFACE TRANSFORMATION
#4 | 2009-02-12Strained semiconductor by full wafer bonding
#5 | 2008-03-06Integrated circuit cooling and insulating device and method
#6 | 2008-02-28Integrated circuit cooling and insulating device and method
#7 | 2007-07-10Memory device
#8 | 2007-05-24Electronic systems using optical waveguide interconnects formed through a semiconductor wafer
#9 | 2007-05-10Conductive material patterning methods
#10 | 2007-04-12Gettering using voids formed by surface transformation
#11 | 2007-04-05Gettering using voids formed by surface transformation
#12 | 2007-03-27Method for operating a memory device having an amorphous silicon carbide gate insulator
#13 | 2007-02-15Method of forming mirrors by surface transformation of empty spaces in solid state materials
#14 | 2007-01-30Method of forming a device having a gate with a selected electron affinity
#15 | 2006-12-26Memory device
#16 | 2006-11-09Integrated circuit cooling and insulating device and method
#17 | 2006-11-09Device, system, and method for a trench capacitor having micro-roughened semiconductor surfaces
#18 | 2006-11-07Low k interconnect dielectric using surface transformation
#19 | 2006-11-02Strained semiconductor by full wafer bonding
#20 | 2006-09-21Removal of copper oxides from integrated interconnects
#21 | 2006-09-19Operating a memory device
#22 | 2006-08-01Removal of copper oxides from integrated interconnects
#23 | 2006-08-01Circuits with a trench capacitor having micro-roughened semiconductor surfaces
#24 | 2006-06-29Method of forming cellular material
#25 | 2006-06-22Electronic systems using optical waveguide interconnects formed throught a semiconductor wafer
#26 | 2006-04-04Method of forming spatial regions of a second material in a first material
#27 | 2006-03-28Three-dimensional complete bandgap photonic crystal formed by crystal modification
#28 | 2006-03-02Integrated circuit cooling and insulating device and method
#29 | 2006-02-14Method of operating a microcavity discharge device
#30 | 2006-02-07Integrated circuits using optical fiber interconnects formed through a semiconductor wafer
#31 | 2006-02-07Integrated circuits using optical waveguide interconnects formed through a semiconductor wafer and methods for forming same
#32 | 2006-02-02Deaprom having amorphous silicon carbide gate insulator
#33 | 2005-12-22Conductive material patterning methods
#34 | 2005-12-06Conductive material patterning methods
#35 | 2005-11-10Gettering using voids formed by surface transformation
#36 | 2005-10-27Microcavity discharge device
#37 | 2005-09-27Hollow core photonic bandgap optical fiber
#38 | 2005-09-27Aligned buried structures formed by surface transformation of empty spaces in solid state materials
#39 | 2005-09-13Scalable high performance antifuse structure and process
#40 | 2005-08-11Method of forming mirrors by surface transformation of empty spaces in solid state materials
#41 | 2005-06-21Three-dimensional photonic band structures in solid materials
#42 | 2005-05-24Three-dimensional photonic crystal waveguide structure and method
#43 | 2005-05-19Three-dimensional photonic crystal waveguide structure and method
#44 | 2005-05-17Spatial regions of a second material in a first material
#45 | 2005-03-31Method of forming mirrors by surface transformation of empty spaces in solid state materials and structures thereon
#46 | 2005-02-10Gettering using voids formed by surface transformation
#47 | 2005-02-10Low k interconnect dielectric using surface transformation
#48 | 2005-02-03Method and structure for high capacitance memory cells
#49 | 2005-02-03Scalable high performance antifuse structure and process
#50 | 2005-01-27Strained semiconductor by full wafer bonding
#51 | 2005-01-27Gettering using voids formed by surface transformation
#52 | 2005-01-11Method of alignment for buried structures formed by surface transformation of empty spaces in solid state materials
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