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Inventor profile of:

Jack E. Hetzner

City:

Reese, Michigan

Country:

United States

Published Applications:

7

Last publication date:

2021-11-11

Top Assignees for applications by Jack E. Hetzner

The entities that hold a legal rights for patent applications filed by inventor Hetzner Jack E.:

  • DOW GLOBAL TECHNOLOGIES LLC 3 Midland, MI United States

Recent patent applications by Hetzner Jack E.

Jack E. Hetzner from Reese, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2021-11-11
US20210347998A1
Chemistry; metallurgy

SEALANT COMPOSITION

#2 | 2021-11-11
US20210347997A1
Chemistry; metallurgy

Sealant composition

#3 | 2013-08-29
US20130225705A1
Chemistry; metallurgy

Flame resistant flexible polyurethane foam

#4 | 2011-12-01
US20110293914A1
Performing operations; transporting

SHAPED FOAM COMPOSITE ARTICLE

#5 | 2010-11-04
US20100280187A1
Chemistry; metallurgy

REACTION INJECTION MOLDED POLYURETHANES MADE USING HIGH LEVELS OF NATURAL OIL-BASED POLYOLS

#6 | 2009-11-05
US20090275673A1
Physics

Benzocyclobutene based polymer formulations and methods for processing such formulations in oxidative environments

#7 | 2007-08-09
US20070185298A1
Chemistry; metallurgy

Organosilicate resin formulation for use in microelectronic devices

InventorID:

3486498 ⎘

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