Daisuke Sakura

City:

Shiga

Country:

Japan

Published Applications:

Last publication date:

2011-12-22

Top Assignees for applications by Daisuke Sakura

The entities that hold a legal rights for patent applications filed by inventor Sakura Daisuke:

TOYO BOSEKI KABUSHIKI KAISHA 1 Osaka, Japan

Recent patent applications by Sakura Daisuke

Daisuke Sakura from Shiga, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2011-12-22

US20110311430A1

Textiles; paper

PROCESS FOR PRODUCTION OF PRECURSOR FIBER FOR PREPARING CARBON FIBER HAVING HIGH STRENGTH AND HIGH ELASTIC MODULUS

#2 | 2010-06-17

US20100151333A1

Textiles; paper

Polyamide imide fiber, non-woven fabric composed of the fiber, process for manufacture of the non-woven fabric, and separator for electronic component

#3 | 2005-05-19

US20050106345A1

Chemistry; metallurgy

Easy-to-tear stretched aliphatic-polyester film

#4 | 2005-05-19

US20050103029A1

Mechanical engineering

Refrigerator having alarm device for alarming leakage of refrigerant

InventorID:

3494902 ⎘