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Inventor profile of:

Daisuke SHIMOKAWA

City:

Osaka

Country:

Japan

Published Applications:

13

Last publication date:

2016-09-08

Top Assignees for applications by Daisuke SHIMOKAWA

The entities that hold a legal rights for patent applications filed by inventor SHIMOKAWA Daisuke:

NITTO DENKO CORPORATION 8 Osaka, Japan
NITTO DENKO CORPORATION 2 Ibaraki-shi, Osaka, Japan
NITTO DENKO CORPORATION 2 Ibaraki-shi, Japan

Recent patent applications by SHIMOKAWA Daisuke

Daisuke SHIMOKAWA from Osaka, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2016-09-08

US20160260937A1

COVERING MATERIAL-PROVIDED NON-AQUEOUS SECONDARY CELL, PRODUCING METHOD THEREOF, AND CELL STACK

#2 | 2013-12-12

US20130330546A1

Chemistry; metallurgy

HEAT-PEELABLE ADHESIVE SHEET

#3 | 2013-10-03

US20130260120A1

Chemistry; metallurgy

HEAT-PEELABLE PRESSURE-SENSITIVE ADHESIVE SHEET

#4 | 2013-07-25

US20130186565A1

Chemistry; metallurgy

POLYMER FOR PRESSURE SENSITIVE ADHESIVE, PRESSURE SENSITIVE ADHESIVE COMPOSITION AND HEAT-PEELABLE PRESSURE SENSITIVE ADHESIVE SHEET

#5 | 2012-09-20

US20120237764A1

PRESSURE-SENSITIVE ADHESIVE TAPE FOR TEMPORARY FIXING OF ELECTRONIC PART

#6 | 2011-08-18

US20110200744A1

ADHESIVE SHEET, PROCESS FOR PRODUCING THE SAME, AND METHOD OF CUTTING MULTILAYERED CERAMIC SHEET

#7 | 2011-04-28

US20110094675A1

Chemistry; metallurgy

Electronic paper manufacturing method and double-sided adhesive tape for electronic paper formation process

#8 | 2010-09-09

US20100224316A1

Heat-peelable pressure-sensitive adhesive sheet for cutting laminated ceramic sheet and method for cut-processing laminated ceramic sheet

#9 | 2010-08-26

US20100215882A1

Chemistry; metallurgy

HEAT-PEELABLE PRESSURE-SENSITIVE ADHESIVE SHEET FOR CUTTING LAMINATED CERAMIC SHEET AND METHOD FOR CUT-PROCESSING LAMINATED CERAMIC SHEET

#10 | 2010-05-13

US20100119816A1

HEAT-PEELABE PRESSURE-SENSITIVE ADHESIVE SHEET CONTAINING LAYERED SILICATE AND PROCESS FOR THE PRODUCTION FOR ELECTRONIC COMPONENTS BY THE USE OF THE SHEET

#11 | 2010-05-13

US20100119791A1

HEAT-PEELABLE PRESSURE-SENSITIVE ADHESIVE SHEET

#12 | 2010-05-13

US20100119757A1

HEAT-PEELABLE DOUBLE-SIDED PRESSURE-SENSITIVE ADHESIVE SHEET

#13 | 2008-07-03

US20080160293A1

Heat-peelable pressure-sensitive adhesive sheet and method for processing adherend using the heat-peelable pressure-sensitive adhesive sheet

InventorID:

349666 ⎘