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Inventor profile of:

Jong-Jin LEE

City:

Daejeon

Country:

South Korea

Published Applications:

35

Last publication date:

2026-07-02

Top Assignees for applications by Jong-Jin LEE

The entities that hold a legal rights for patent applications filed by inventor LEE Jong-Jin:

Electronics and Telecommunications Research Institute 13 Daejeon, South Korea
SAMSUNG ELECTRO-MECHANICS CO., LTD. 7 Suwon, South Korea
Samsung Electro-Mechanics Co., Ltd. 4 Kyunggi-do, South Korea
SAMSUNG ELECTRO-MECHANICS CO., LTD. 3 Gyunggi-do, South Korea
SAMSUNG ELECTRO-MECHANICS CO., LTD. 3 Suwon-si, South Korea
LG CHEM, LTD. 2 Seoul, South Korea
KOREA E & S CO., LTD. 1 Daegu, South Korea
KOREA E&S CO., LTD. 1 Daeju, South Korea
SAMSUNG ELECTRO-MECHANICS CO., LTD. 1 Gyeonggi-do, South Korea

Recent patent applications by LEE Jong-Jin

Jong-Jin LEE from Daejeon, KR has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2026-07-02

US20260185242A1

Chemistry; metallurgy

ELECTROLYZER

#2 | 2026-06-25

US20260180684A1

MULTI-CHANNEL OPTICAL TRANSCEIVER

#3 | 2026-04-02

US20260096498A1

SURFACE-MOUNT-TYPE OPTICAL MODULE AND CO-PACKAGED OPTICS SWITCH ASSEMBLY INCLUDING THE SAME

#4 | 2026-03-26

US20260086302A1

OPTICAL ALIGNMENT APPARATUS OF OPTICAL DEVICE AND OPTICAL ALIGNMENT METHOD THEREOF

#5 | 2026-02-19

US20260049407A1

Chemistry; metallurgy

Carbon Dioxide Electrolysis Device and Method

#6 | 2026-01-15

US20260014527A1

Performing operations; transporting

Separator and Electrochemical Conversion Cell Including the Same

#7 | 2025-05-15

US20250159854A1

EPOXY DISPENSING DEVICE AND METHOD OF MOUNTING ELECTRONIC COMPONENT ON SUBSTRATE BY USING THE SAME

#8 | 2025-05-15

US20250158349A1

LENS CURING DEVICE AND METHOD FOR MULTI-CHANNEL OPTICAL MODULE

#9 | 2025-05-15

US20250157979A1

REFLOW FLIP CHIP BONDING TOOL APPARATUS AND OPERATING METHOD THEREOF

#10 | 2025-04-17

US20250120631A1

Human necessities

APPARATUS AND METHOD FOR DIAGNOSING DISEASE BASED ON IMAGE

#11 | 2025-03-20

US20250093599A1

OPTICAL MODULE ASSEMBLY

#12 | 2025-03-06

US20250076601A1

OPTICAL RECEIVING MODULE ASSEMBLY

#13 | 2024-04-18

US20240129035A1

DETACHABLE LIGHT SOURCE SUPPLY APPARATUS AND OPTICAL TRANSCEIVER HAVING THE SAME

#14 | 2024-04-18

US20240126041A1

OPTICAL ALIGNMENT APPARATUS AND METHOD FOR SURFACE MOUNTABLE OPTICAL MODULE

#15 | 2024-03-28

US20240106540A1

OPTICAL TRANSCEIVER FOR HIGH-PRECISION BONDING OF FLEXIBLE PRINTED CIRCUIT BOARD AND CERAMIC FEED-THROUGH STRUCTURE AND PACKAGE STRUCTURE

#16 | 2024-03-21

US20240094463A1

SURFACE MOUNT TYPE OPTICAL MODULE AND ATTACHMENT/DETACHMENT APPARATUS AND METHOD THEREOF

#17 | 2023-03-02

US20230069724A1

Receiver optical sub-assembly, multi-channel receiver optical sub-assembly, and operating method thereof

#18 | 2023-03-02

US20230067645A1

Highly-integrated multi-channel optical module having lens mounting structure for minimizing optical alignment error and lens assembly process thereof

#19 | 2023-03-02

US20230061382A1

Multi-channel optical sub-assembly

#20 | 2015-12-31

US20150382461A1

Printed circuit board and method for manufacturing the same

#21 | 2013-07-25

US20130186677A1

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

#22 | 2012-07-05

US20120168212A1

Printed circuit board and method for manufacturing the same

#23 | 2011-09-22

US20110227228A1

Performing operations; transporting

FILLING COMPOSITION, SEMICONDUCTOR DEVICE INCLUDING THE SAME, AND METHOD OF FABRICATING THE SEMICONDUCTOR DEVICE

#24 | 2010-04-15

US20100090351A1

Electro component package

#25 | 2010-01-21

US20100012364A1

Method of manufacturing electronic component embedded circuit board

#26 | 2009-07-16

US20090178830A1

Printed circuit board and component package having the same

#27 | 2009-04-02

US20090083976A1

Method for manufacturing printed circuit board

#28 | 2009-01-29

US20090027864A1

Printed circuit board and manufacturing method thereof

#29 | 2008-03-27

US20080073025A1

Performing operations; transporting

Method of manufacturing copper-clad laminate for VOP application

#30 | 2007-12-27

US20070298546A1

Manufacturing method package substrate

#31 | 2007-09-06

US20070207607A1

Ball grid array substrate having window and method of fabricating same

#32 | 2007-08-14

US10609499

Package substrate manufactured using electrolytic leadless plating process, and method for manufacturing the same

#33 | 2006-06-22

US20060131729A1

Ball grid array substrate having window and method of fabricating same

#34 | 2005-05-05

US20050095862A1

Package substrate manufactured using electrolytic leadless plating process, and method for manufacturing the same

#35 | 2005-03-29

US10626437

Package substrate for electrolytic leadless plating and manufacturing method thereof

InventorID:

349879 ⎘