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Inventor profile of:

Eiichi Okazaki

City:

Aichi

Country:

Japan

Published Applications:

7

Last publication date:

2024-01-11

Top Assignees for applications by Eiichi Okazaki

The entities that hold a legal rights for patent applications filed by inventor Okazaki Eiichi:

  • TOAGOSEI CO., LTD 4 Tokyo, Japan

Recent patent applications by Okazaki Eiichi

Eiichi Okazaki from Aichi, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2024-01-11
US20240010756A1
Chemistry; metallurgy

PRODUCTION METHOD OF NANOCELLULOSE-CONTAINING COMPOSITION

#2 | 2011-12-29
US20110319582A1
Chemistry; metallurgy

Curable composition comprising inorganic oxide microparticles that are surface-modified with maleimide groups

#3 | 2007-08-09
US20070184353A1
Physics

Volume hologram recording material and volume hologram recording medium

#4 | 2007-07-26
US20070172742A1
Physics

Volume hologram recording material and volume hologram recording medium

#5 | 2006-08-17
US20060182956A1
Chemistry; metallurgy

Radiation-curable pressure-sensitive adhesive composition and pressure-sensitive adhesive sheets

#6 | 2006-08-01
US9883406
-

Crosslinkable resin compositions

#7 | 2005-05-12
US20050101683A1
Chemistry; metallurgy

Pressure-sensitive adhesive curable with active energy ray and pressure-sensitive adhesive sheet

InventorID:

3500619 ⎘

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