Inventor profile of:

Jason R. Eagle

City:

Kasson, Minnesota

Country:

United States

Published Applications:

15

Last publication date:

2018-03-22

Top Assignees for applications by Jason R. Eagle

The entities that hold a legal rights for patent applications filed by inventor Eagle Jason R.:

Recent patent applications by Eagle Jason R.

Jason R. Eagle from Kasson, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2018-03-22
US20180080494A1
Mechanical engineering

Captive externally threaded fastener

#2 | 2017-11-21
US15271526
Mechanical engineering

Captive externally threaded fastener method

#3 | 2017-07-06
US20170196075A1
Electricity

Integrated circuit device assembly

#4 | 2017-05-11
US20170133810A1
Electricity

Module placement apparatus

#5 | 2014-09-18
US20140268575A1
Electricity

Implementing heat sink loading having multipoint loading with actuation outboard of heatsink footprint

#6 | 2014-05-08
US20140127915A1
Electricity

Implementing connection of two large electronic boards utilizing LGA interconnect

#7 | 2013-07-25
US20130188316A1
Electricity

Fluid cooling system and associated fitting assembly for electronic component

#8 | 2012-06-14
US20120147563A1
Physics

Implementing loading and heat removal for hub module assembly

#9 | 2012-05-17
US20120120605A1
Electricity

In-line memory and circuit board cooling system

#10 | 2012-05-03
US20120106071A1
Electricity

Fluid cooling system and associated fitting assembly for electronic component

#11 | 2009-04-02
US20090083972A1
Electricity

Electronic assembly and techniques for installing a heatsink in an electronic assembly

#12 | 2009-02-10
US11972168
-

Apparatus and method that minimizing dimensional instability and solder stress in surface mounted interconnections

#13 | 2009-02-05
US20090034198A1
Electricity

APPARATUS AND METHOD FOR ATTACHING HEATSINKS

#14 | 2008-02-21
US20080044576A1
Performing operations; transporting

Method and Apparatus for Applying Thermal Interface Material

#15 | 2008-01-31
US20080024991A1
Electricity

Heatsink apparatus for applying a specified compressive force to an integrated circuit device

InventorID:

352349 ⎘