Ravikumar Adimula

City:

Chandler, Arizona

Country:

United States

Published Applications:

Last publication date:

2011-06-02

Top Assignees for applications by Ravikumar Adimula

The entities that hold a legal rights for patent applications filed by inventor Adimula Ravikumar:

Ravikumar Adimula from Chandler, US has applied for patents for these inventions. The list has both pending applications and granted patents:

Package including at least one topological feature on an encapsulant material to resist out-of-plane deformation

SEMICONDUCTOR PACKAGE SUBSTRATE WITH METAL BUMPS

Multi-die building block for stacked-die package

InventorID:

3540890 ⎘