Hee Kon Lee

City:

Country:

United States

Published Applications:

Last publication date:

2011-06-02

Top Assignees for applications by Hee Kon Lee

The entities that hold a legal rights for patent applications filed by inventor Lee Hee Kon:

Hee Kon Lee from , US has applied for patents for these inventions. The list has both pending applications and granted patents:

Method of manufacturing stacked wafer level package

InventorID:

3542572 ⎘