Daisuke Furukawa

City:

Chikuma

Country:

Japan

Published Applications:

Last publication date:

2011-06-02

Top Assignees for applications by Daisuke Furukawa

The entities that hold a legal rights for patent applications filed by inventor Furukawa Daisuke:

Daisuke Furukawa from Chikuma, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

Wafer polishing method and double-side polishing apparatus

InventorID:

3542662 ⎘