Mark Bachman

City:

Sinking Spring, Pennsylvania

Country:

United States

Published Applications:

Last publication date:

2011-07-07

Top Assignees for applications by Mark Bachman

The entities that hold a legal rights for patent applications filed by inventor Bachman Mark:

Agere Systems Inc. 2 Allentown, PA United States
AGERE SYSTEMS LLC 1 Wilmington, DE United States

Recent patent applications by Bachman Mark

Mark Bachman from Sinking Spring, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2011-07-07

US20110163441A1

Electricity

PB-free solder bumps with improved mechanical properties

#2 | 2010-03-04

US20100052174A1

Electricity

COPPER PAD FOR COPPER WIRE BONDING

InventorID:

3545086 ⎘