Inventor profile of:

Roy R. YU

City:

Poughkeepsie, New York

Country:

United States

Published Applications:

66

Last publication date:

2026-06-18

Top Assignees for applications by Roy R. YU

The entities that hold a legal rights for patent applications filed by inventor YU Roy R.:

Recent patent applications by YU Roy R.

Roy R. YU from Poughkeepsie, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2026-06-18
US20260173953A1
Electricity

MULTIDIE AND WAFER SEMICONDUCTOR STRUCTURES

#2 | 2026-06-11
US20260165112A1
Electricity

METALLURGY STRUCTURE FOR HYBRID BONDING

#3 | 2026-05-07
US20260130222A1
Electricity

REDUCED WARPAGE ELECTRONIC PACKAGE AND PACKAGING STRUCTURE

#4 | 2026-03-05
US20260068574A1
Electricity

OPTIMIZED DICING STREET/KERF FOR CHIPLET APPLICATION

#5 | 2025-10-30
US20250336853A1
Electricity

HETEROGENEOUS HYBRID BONDING

#6 | 2025-03-13
US20250087629A1
Electricity

Dicing Street Design for Hybrid Bonding

#7 | 2024-10-03
US20240332398A1
Electricity

HIGH DENSITY METAL-INSULATOR-METAL CAPACITOR

#8 | 2024-07-04
US20240222313A1
Electricity

Structures and Processes for Void-Free Hybrid Bonding

#9 | 2023-05-18
US20230154784A1
Electricity

BOTTOM DIELECTRIC ISOLATION INTEGRATION WITH BURIED POWER RAIL

#10 | 2023-05-04
US20230133157A1
Electricity

Backside metal-insulator-metal (MIM) capacitors extending through backside interlayer dielectric (BILD) layer or semiconductor layer and partly through dielectric layer

#11 | 2023-03-30
US20230094466A1
Electricity

NANOSHEET TRANSISTORS WITH BURIED POWER RAILS

#12 | 2023-03-23
US20230093101A1
Electricity

Backside electrical contacts to buried power rails

#13 | 2022-12-15
US20220399224A1
Electricity

Backside power rail integration

#14 | 2022-09-22
US20220301878A1
Electricity

Substrate thinning for a backside power distribution network

#15 | 2020-06-04
US20200176262A1
Electricity

Nanostructure featuring nano-topography with optimized electrical and biochemical properties

#16 | 2020-06-04
US20200170533A1
Human necessities

Three-dimensional silicon-based comb probe

#17 | 2020-06-04
US20200170523A1
Human necessities

Three-dimensional silicon-based comb probe with optimized biocompatible dimensions for neural sensing and stimulation

#18 | 2020-04-09
US20200108244A1
Human necessities

Neuro-stem cell stimulation and growth enhancement with implantable nanodevice

#19 | 2020-03-26
US20200094300A1
Performing operations; transporting

Neuro-chemical sensor with inhibition of fouling on nano-electrode

#20 | 2020-03-19
US20200087700A1
Chemistry; metallurgy

Biosensor for multi-analyte characterization

#21 | 2020-01-09
US20200009369A1
Human necessities

Neuro-stem cell stimulation and growth enhancement with implantable nanodevice

#22 | 2020-01-09
US20200009368A1
Human necessities

Neuro-stem cell stimulation and growth enhancement with implantable nanodevice

#23 | 2019-12-05
US20190366102A1
Human necessities

Biosensor package

#24 | 2019-05-16
US20190146245A1
Physics

Saccade and vergence tracking for distance auto focus adjustment

#25 | 2019-05-16
US20190143095A1
Human necessities

Neuro-stem cell stimulation and growth enhancement with implantable nanodevice

#26 | 2019-05-09
US20190134420A1
Human necessities

Cognitive optogenetics probe and analysis

#27 | 2019-04-04
US20190101504A1
Physics

On-chip biosensors with nanometer scale glass-like carbon electrodes and improved adhesive coupling

#28 | 2019-04-04
US20190101503A1
Physics

On-chip biosensors with nanometer scale glass-like carbon electrodes and improved adhesive coupling

#29 | 2019-02-14
US20190048382A1
Chemistry; metallurgy

Biosensor for multi-analyte characterization

#30 | 2018-11-29
US20180340204A1
Chemistry; metallurgy

Neuro-chemical sensor with selectively permeable membrane on nano-electrode

#31 | 2018-11-29
US20180340203A1
Chemistry; metallurgy

Neuro-chemical sensor with selectively permeable membrane on nano-electrode

#32 | 2018-11-29
US20180339321A1
Performing operations; transporting

Neuro-chemical sensor with inhibition of fouling on nano-electrode

#33 | 2018-11-29
US20180339320A1
Performing operations; transporting

Neuro-chemical sensor with inhibition of fouling on nano-electrode

#34 | 2018-11-29
US20180339155A1
Human necessities

Intelligent and disposable device for selective electrical stimulation of apoptosis

#35 | 2018-11-29
US20180339154A1
Human necessities

Intelligent and disposable device for selective electrical stimulation of apoptosis

#36 | 2018-09-27
US20180272048A1
Human necessities

Antibacterial medical implant surface

#37 | 2018-09-27
US20180272047A1
Human necessities

Antibacterial medical implant surface

#38 | 2018-09-27
US20180272046A1
Human necessities

Antibacterial medical implant surface

#39 | 2018-09-27
US20180272045A1
Human necessities

Antibacterial medical implant surface

#40 | 2018-05-24
US20180143140A1
Physics

Patch clamp technique with complementary raman spectroscopy

#41 | 2018-04-19
US20180103848A1
Human necessities

Probe structure for physiological measurements using surface enhanced Raman spectroscopy

#42 | 2018-04-19
US20180103847A1
Human necessities

Probe structure for physiological measurements using surface enhanced Raman spectroscopy

#43 | 2017-12-14
US20170356851A1
Physics

Patch clamp technique with complementary Raman spectroscopy

#44 | 2017-07-06
US20170192254A1
Physics

Saccade and vergence tracking for distance auto focus adjustment

#45 | 2017-07-06
US20170190127A1
Performing operations; transporting

Saccade and vergence tracking for distance auto focus adjustment

#46 | 2015-09-24
US20150270246A1
Electricity

Volumetric integrated circuit and volumetric integrated circuit manufacturing method

#47 | 2015-01-22
US20150024549A1
Electricity

Alignment of integrated circuit chip stack

#48 | 2015-01-22
US20150024548A1
Electricity

Computer readable medium encoded with a program for fabricating 3D integrated circuit device using interface wafer as permanent carrier

#49 | 2014-01-23
US20140024146A1
Electricity

SEMICONDUCTOR STRUCTURE

#50 | 2014-01-23
US20140021616A1
Electricity

SEMICONDUCTOR STRUCTURE

#51 | 2013-07-25
US20130189813A1
Electricity

COMPUTER READABLE MEDIUM ENCODED WITH A PROGRAM FOR FABRICATING A 3D INTEGRATED CIRCUIT STRUCTURE

#52 | 2012-12-06
US20120309127A1
Electricity

Method for fabricating 3D integrated circuit device using interface wafer as permanent carrier

#53 | 2012-11-29
US20120299200A1
Electricity

3D integrated circuit device having lower-cost active circuitry layers stacked before higher-cost active circuitry layer

#54 | 2012-09-13
US20120233510A1
Physics

High memory density, high input/output bandwidth logic-memory structure and architecture

#55 | 2012-06-21
US20120153429A1
Electricity

3D integrated circuit device fabrication with precisely controllable substrate removal

#56 | 2012-06-14
US20120149173A1
Electricity

3D integrated circuit device fabrication with precisely controllable substrate removal

#57 | 2011-10-13
US20110248396A1
Electricity

Bow-balanced 3D chip stacking

#58 | 2010-12-16
US20100314711A1
Electricity

Method for fabricating a 3D integrated circuit device having lower-cost active circuitry layers stacked before higher-cost active circuitry layer

#59 | 2010-08-05
US20100196806A1
Electricity

STRUCTURES AND METHODS FOR LOW-K OR ULTRA LOW-K INTERLAYER DIELECTRIC PATTERN TRANSFER

#60 | 2010-02-25
US20100047964A1
Electricity

3D integrated circuit device fabrication using interface wafer as permanent carrier

#61 | 2010-02-25
US20100044826A1
Electricity

3D integrated circuit device fabrication with precisely controllable substrate removal

#62 | 2009-08-06
US20090197390A1
Electricity

Lock and key structure for three-dimensional chip connection and process thereof

#63 | 2009-01-01
US20090004596A1
Physics

Fused aromatic structures and methods for photolithographic applications

#64 | 2008-05-08
US20080105976A1
Electricity

Metal filled through via structure for providing vertical wafer-to-wafer interconnection

#65 | 2008-03-18
US11459784
-

Metal filled through via structure for providing vertical wafer-to-wafer interconnection

#66 | 2007-11-08
US20070259291A1
Electricity

Structures and methods for low-k or ultra low-k interlayer dielectric pattern transfer

InventorID:

354791 ⎘