DEEPUKUMAR M. NAIR

City:

Cary, North Carolina

Country:

United States

Published Applications:

Last publication date:

2014-12-04

Top Assignees for applications by DEEPUKUMAR M. NAIR

The entities that hold a legal rights for patent applications filed by inventor NAIR DEEPUKUMAR M.:

E. I. DU PONT DE NEMOURS AND COMPANY 4 Wilmington, DE United States
GEORGIA TECH RESEARCH CORPORATION 2 Wilmington, DE United States
E.I. DU PONT DE NEMOURS AND COMPANY 1 Wilmington, DE United States
Georgia Tech Research Corporation 1 Atlanta, GA United States
E I DU PONT NEMOURS AND COMPANY 1 Wilmington, DE United States
Wemtec, Inc. 1 Fulton, MD United States

Recent patent applications by NAIR DEEPUKUMAR M.

DEEPUKUMAR M. NAIR from Cary, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2014-12-04

US20140354513A1

Electricity

Method of fabricating electromagnetic bandgap (EBG) structures for microwave/millimeterwave applications using laser processing of unfired low temperature co-fired ceramic (LTCC) tape

#2 | 2014-12-04

US20140353005A1

Performing operations; transporting

METHOD OF MAKING MICROWAVE AND MILLIMETERWAVE ELECTRONIC CIRCUITS BY LASER PATTERNING OF UNFIRED LOW TEMPERATURE CO-FIRED CERAMIC (LTCC) SUBSTRATES

#3 | 2013-07-25

US20130189935A1

Electricity

Low temperature co-fired ceramic (LTCC) system in a package (SiP) configurations for microwave/millimeter wave packaging applications

#4 | 2012-12-06

US20120305296A1

Electricity

Low temperature co-fired ceramic structure for high frequency applications and process for making same

#5 | 2011-08-04

US20110187602A1

Chemistry; metallurgy

Method of manufacturing high frequency receiving and/or transmitting devices from low temperature co-fired ceramic materials and devices made therefrom

#6 | 2010-10-28

US20100270646A1

Electricity

THIN-FILM CAPACITOR STRUCTURES EMBEDDED IN SEMICONDUCTOR PACKAGES AND METHODS OF MAKING

#7 | 2010-10-28

US20100270645A1

Electricity

Thin-film capacitor structures embedded in semiconductor packages and methods of making

InventorID:

354974 ⎘