Michael Arnett Smith

City:

Wake Forest, North Carolina

Country:

United States

Published Applications:

Last publication date:

2014-12-04

Top Assignees for applications by Michael Arnett Smith

The entities that hold a legal rights for patent applications filed by inventor Smith Michael Arnett:

E. I. DU PONT DE NEMOURS AND COMPANY 3 Wilmington, DE United States
E.I. DU PONT DE NEMOURS AND COMPANY 1 Wilmington, DE United States
E I DU PONT NEMOURS AND COMPANY 1 Wilmington, DE United States
Wemtec, Inc. 1 Fulton, MD United States

Recent patent applications by Smith Michael Arnett

Michael Arnett Smith from Wake Forest, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2014-12-04

US20140354513A1

Electricity

Method of fabricating electromagnetic bandgap (EBG) structures for microwave/millimeterwave applications using laser processing of unfired low temperature co-fired ceramic (LTCC) tape

#2 | 2014-12-04

US20140353005A1

Performing operations; transporting

METHOD OF MAKING MICROWAVE AND MILLIMETERWAVE ELECTRONIC CIRCUITS BY LASER PATTERNING OF UNFIRED LOW TEMPERATURE CO-FIRED CERAMIC (LTCC) SUBSTRATES

#3 | 2013-07-25

US20130189935A1

Electricity

Low temperature co-fired ceramic (LTCC) system in a package (SiP) configurations for microwave/millimeter wave packaging applications

#4 | 2012-12-06

US20120305296A1

Electricity

Low temperature co-fired ceramic structure for high frequency applications and process for making same

#5 | 2011-02-03

US20110027539A1

Electricity

IMPROVED PROCESS FOR PRESSURELESS CONSTRAINED SINTERING OF LOW TEMPERATURE CO-FIRED CERAMIC WITH SURFACE CIRCUIT PATTERNS

InventorID:

354975 ⎘