Mark D. Schultz

SEMICONDUCTOR DEVICE WITH EMBEDDED COOLING

#2 | 2025-07-17

US20250233051A1

MULTIPLE CHIP MODULE DIRECT ATTACH COOLING

#3 | 2024-11-28

US20240397686A1

PROCESSOR MODULE INSTALLATION TOOL WITH PROTECTIVE INTERLOCK FEATURE

#4 | 2024-09-05

US20240298423A1

COLD PLATE WITH UNIFORM PLENUM FLOW

#5 | 2024-03-21

US20240098935A1

COMPLIANT COUNTER-FLOW COLD PLATE

#6 | 2023-09-21

US20230296332A1

Reduced pressure drop cold plate transition

#7 | 2023-06-29

US20230207523A1

WAFER TO WAFER HIGH DENSITY INTERCONNECTS

#8 | 2023-06-15

US20230184833A1

INTEGRATED CIRCUIT CHIP HAVING BACK-SURFACE TOPOGRAPHY FOR ENHANCED COOLING DURING CHIP TESTING

#9 | 2022-12-29

US20220418134A1

Rotating lid for module cooler

#10 | 2022-12-29

US20220418129A1

Temporary removable module lid

#11 | 2022-10-13

US20220328375A1

Co-packaged optical module

#12 | 2022-06-30

US20220210946A1

Cold plate with uniform plenum flow

#13 | 2022-06-30

US20220205740A1

Reduced pressure drop cold plate transition

#14 | 2022-03-17

US20220084969A1

Wafer scale supercomputer

#15 | 2021-08-05

US20210243919A1

Data center coolant switch

#16 | 2020-12-24

US20200400387A1

Pattern bonded finned cold plate

#17 | 2020-08-06

US20200253092A1

Energy efficiency based control for a cooling system

#18 | 2020-07-09

US20200221610A1

Mechanically flexible cold plates for low power components

#19 | 2020-07-02

US20200211924A1

Thermal interface formed by condensate

#20 | 2020-04-16

US20200118907A1

Counter-flow expanding channels for enhanced two-phase heat removal

#21 | 2020-03-19

US20200091037A1

Counter-flow expanding channels for enhanced two-phase heat removal

#22 | 2020-01-23

US20200029470A1

Data center coolant switch

#23 | 2019-11-14

US20190348345A1

Module lid with embedded two-phase cooling and insulating layer

#24 | 2019-07-25

US20190230816A1

Two-phase liquid cooled electronics

#25 | 2019-06-27

US20190200485A1

Mechanically flexible cold plates for low power components

#26 | 2019-05-23

US20190154340A1

Burst resistant thin wall heat sink

#27 | 2019-05-09

US20190139938A1

Large channel interconnects with through silicon Vias (TSVs) and method for constructing the same

#28 | 2019-01-17

US20190020597A1

High-density, fail-in-place switches for computer and data networks

#29 | 2018-08-23

US20180240735A1

Compliant pin fin heat sink and methods

#30 | 2018-06-28

US20180182686A1

Counter-flow expanding channels for enhanced two-phase heat removal

#31 | 2018-06-14

US20180164048A1

Pin fin compliant heat sink with enhanced flexibility

#32 | 2018-05-03

US20180124949A1

Cold plate

#33 | 2017-11-28

US15226971

Heat sink for semiconductor modules

#34 | 2017-10-05

US20170287809A1

Compliant Pin Fin heat sink with base integral pins

#35 | 2017-08-17

US20170236770A1

Compliant pin fin heat sink and methods

#36 | 2017-06-22

US20170179001A1

Counter-flow expanding channels for enhanced two-phase heat removal

#37 | 2017-06-15

US20170170092A1

Near-chip compliant layer for reducing perimeter stress during assembly process

#38 | 2017-06-08

US20170160501A1

Thermal management of optical coupling systems

#39 | 2017-06-01

US20170155598A1

High-density, fail-in-place switches for computer and data networks

#40 | 2017-04-13

US20170102273A1

Calibrating thermal behavior of electronics

#41 | 2017-02-14

US14963466

Near-chip compliant layer for reducing perimeter stress during assembly process

#42 | 2016-10-06

US20160290728A1

Flexible cold plate with enhanced flexibility

#43 | 2016-10-06

US20160290727A1

Burst resistant thin wall heat sink

#44 | 2016-09-01

US20160252408A1

Calibrating thermal behavior of electronics

#45 | 2016-05-05

US20160128232A1

Interlayer chip cooling apparatus

#46 | 2016-03-31

US20160091260A1

Pin fin compliant heat sink with enhanced flexibility

#47 | 2016-01-21

US20160021795A1

Data center coolant switch

#48 | 2016-01-21

US20160021794A1

Data center coolant switch

#49 | 2015-10-08

US20150289406A1

High-density, fail-in-place switches for computer and data networks

#50 | 2015-08-06

US20150221613A1

Large channel interconnects with through silicon vias (TSVs) and method for constructing the same

#51 | 2014-07-10

US20140192476A1

Cooling apparatus with a resilient heat conducting member

#52 | 2014-07-10

US20140190681A1

Energy efficiency based control for a cooling system

#53 | 2014-06-05

US20140153607A1

Calibrating thermal behavior of electronics

#54 | 2014-01-23

US20140022725A1

Information technology equipment cooling system

#55 | 2014-01-23

US20140020885A1

Data center cooling method

#56 | 2014-01-23

US20140020884A1

Information technology equipment cooling method

#57 | 2014-01-23

US20140020418A1

Data center cooling system

#58 | 2013-08-08

US20130199767A1

Compliant pin fin heat sink and methods

#59 | 2013-05-30

US20130138253A1

Dynamically limiting energy consumed by cooling apparatus

#60 | 2013-05-30

US20130138252A1

Dynamically limiting energy consumed by cooling apparatus

#61 | 2013-01-17

US20130014926A1

Data center coolant switch

#62 | 2012-11-08

US20120281358A1

Cooled electronic system with thermal spreaders coupling electronics cards to cold rails

#63 | 2012-11-08

US20120279047A1

Method of fabricating a cooled electronic system

#64 | 2012-08-02

US20120193833A1

Method of full-field solder coverage by inverting a fill head and a mold

#65 | 2011-08-25

US20110203762A1

Performing operations; transporting

Method of full-field solder coverage using a vacuum fill head

#66 | 2010-10-07

US20100252225A1

Step-down transition of a solder head in the injection molding soldering process

#67 | 2009-07-23

US20090183849A1

Fill head for full-field solder coverage with a rotatable member

#68 | 2009-06-18

US20090151907A1

COMPLIANT THERMAL INTERFACE DESIGN AND ASSEMBLY METHOD

#69 | 2009-06-18

US20090151893A1

HIGH PERFORMANCE COMPLIANT THERMAL INTERFACE COOLING STRUCTURES

#70 | 2009-06-11

US20090147394A1

Management of data cartridges in multiple-cartridge cells in an automated data storage library

#71 | 2009-04-14

US11374190

Data storage cartridge gripper with deep-reach

#72 | 2008-12-04

US20080298016A1

COOLING AN ELECTRONIC DEVICE UTILIZING SPRING ELEMENTS WITH FINS

#73 | 2008-10-09

US20080247165A1

METHOD AND APPARATUS FOR INCREASING VISIBILITY OF A LASER POINTER

#74 | 2008-08-07

US20080185118A1

Reduced friction molds for injection molded solder processing

#75 | 2008-07-17

US20080170370A1

Cooling structure using rigid movable elements

#76 | 2008-07-17

US20080170033A1

VIRTUAL POINTER

#77 | 2008-06-19

US20080144288A1

Performing operations; transporting

Compliant thermal interface structure utilizing spring elements

#78 | 2008-02-28

US20080048008A1

Method for step-down transition of a solder head in the injection molding soldering process

#79 | 2007-11-29

US20070272425A1

Multidimensional Compliant Thermal Cap for an Electronic Device

#80 | 2007-09-13

US20070211366A1

Management of data cartridges in multiple-cartridge cells in an automated data storage library

#81 | 2006-12-14

US20060279936A1

Cooling structure using rigid movable elements

#82 | 2006-12-14

US20060279935A1

Compliant thermal interface structure utilizing spring elements

#83 | 2006-12-14

US20060279932A1

Compliant thermal interface structure utilizing spring elements with fins

#84 | 2006-03-28

US10184343

Self-servo-writing multi-slot timing pattern

#85 | 2006-03-23

US20060060367A1

Multi-dimensional compliant thermal cap for an electronic device

#86 | 2006-03-21

US10990913

Timing mark position error correction in self-servo write

#87 | 2006-03-02

US20060044667A1

Method and apparatus for providing combined radial and timing multislot self-servowrite propagation

#88 | 2006-02-16

US20060034060A1

Compliant thermal cap for an electronic device

#89 | 2006-02-02

US20060021747A1

Liquid cooling structure for electronic device

#90 | 2005-01-06

US20050002120A1