Daisuke Souma

City:

Tokyo

Country:

Japan

Published Applications:

Last publication date:

2024-03-28

Top Assignees for applications by Daisuke Souma

The entities that hold a legal rights for patent applications filed by inventor Souma Daisuke:

Daisuke Souma from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

CORE MATERIAL, ELECTRONIC COMPONENT AND METHOD FOR FORMING BUMP ELECTRODE

Core material, electronic component and method for forming bump electrode

Core material, electronic component and method for forming bump electrode

Method for forming bump electrode substrate

Storing package unit and a storing method for micro solder spheres

InventorID:

3561679 ⎘