Tomoko Kishimoto

City:

Osaka

Country:

Japan

Published Applications:

Last publication date:

2011-08-18

Top Assignees for applications by Tomoko Kishimoto

The entities that hold a legal rights for patent applications filed by inventor Kishimoto Tomoko:

NITTO DENKO CORPORATION 2 Osaka, Japan
NITTO DENKO CORPORATION 2 Ibaraki-shi, Japan

Recent patent applications by Kishimoto Tomoko

Tomoko Kishimoto from Osaka, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2011-08-18

US20110200744A1

Electricity

ADHESIVE SHEET, PROCESS FOR PRODUCING THE SAME, AND METHOD OF CUTTING MULTILAYERED CERAMIC SHEET

#2 | 2010-05-13

US20100119816A1

Electricity

HEAT-PEELABE PRESSURE-SENSITIVE ADHESIVE SHEET CONTAINING LAYERED SILICATE AND PROCESS FOR THE PRODUCTION FOR ELECTRONIC COMPONENTS BY THE USE OF THE SHEET

#3 | 2008-07-17

US20080169062A1

Electricity

Thermal-release double-coated pressure-sensitive adhesive tape or sheet and method of processing adherend

InventorID:

3563258 ⎘