Huilin Ren

City:

Country:

United States

Published Applications:

Last publication date:

2011-09-01

Top Assignees for applications by Huilin Ren

The entities that hold a legal rights for patent applications filed by inventor Ren Huilin:

Huilin Ren from , US has applied for patents for these inventions. The list has both pending applications and granted patents:

High density electrical connector with variable insertion and retention force

High density electrical connector and PCB footprint

InventorID:

3567443 ⎘