Daisuke Serino

City:

Aichi

Country:

Japan

Published Applications:

Last publication date:

2011-10-13

Top Assignees for applications by Daisuke Serino

The entities that hold a legal rights for patent applications filed by inventor Serino Daisuke:

Daisuke Serino from Aichi, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

Powder-containing oil based mold lubricant and method and apparatus for applying the lubricant

InventorID:

3574312 ⎘