Guy T. Blalock

City:

Eagle, Idaho

Country:

United States

Published Applications:

Last publication date:

2011-10-13

Top Assignees for applications by Guy T. Blalock

The entities that hold a legal rights for patent applications filed by inventor Blalock Guy T.:

Micron Technology, Inc. 7 Boise, ID United States
Micron Technology, Inc. 1 Boise, IA United States

Recent patent applications by Blalock Guy T.

Guy T. Blalock from Eagle, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2011-10-13

US20110250753A1

Electricity

Atomic layer deposition methods

#2 | 2010-07-15

US20100176083A1

Electricity

Method for removing metal layers formed outside an aperture of a BPSG layer utilizing multiple etching processes including electrochemical-mechanical polishing

#3 | 2009-11-12

US20090280639A1

Electricity

Atomic layer deposition methods

#4 | 2009-01-01

US20090004951A1

Performing operations; transporting

Apparatus for removing material from microfeature workpieces

#5 | 2007-04-12

US20070082468A1

Electricity

Atomic layer deposition methods

#6 | 2007-03-01

US20070049172A1

Performing operations; transporting

Apparatus and method for removing material from microfeature workpieces

#7 | 2006-05-23

US9923058

Method for enhancing silicon dioxide to silicon nitride selectivity

InventorID:

3574628 ⎘