Boise, Idaho
United States
4
2011-10-13
The entities that hold a legal rights for patent applications filed by inventor Steckert Daniel A.:
Daniel A. Steckert from Boise, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Method to reduce charge buildup during high aspect ratio contact etch
#2 | 2008-06-05Method to reduce charge buildup during high aspect ratio contact etch
#3 | 2007-03-01Method to reduce charge buildup during high aspect ratio contact etch
#4 | 2006-03-02Implanted photoresist to reduce etch erosion during the formation of a semiconductor device
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