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Inventor profile of:

Daniel Lewis

City:

Delmar, New York

Country:

United States

Published Applications:

1

Last publication date:

2010-03-18

Recent patent applications by Lewis Daniel

Daniel Lewis from Delmar, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2010-03-18

US20100068556A1

Chemistry; metallurgy

Diffusion barrier layer and methods of forming

InventorID:

3597412 ⎘