Atascadero, California
United States
37
2013-03-26
The entities that hold a legal rights for patent applications filed by inventor Boyd John M.:
John M. Boyd from Atascadero, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Pre-planarization system and method
#2 | 2010-05-06System method and apparatus for dry-in, dry-out, low defect laser dicing using proximity technology
#3 | 2009-12-31Apparatus for plating semiconductor wafers
#4 | 2009-10-06Method and system to separate and recycle divergent chemistries
#5 | 2008-11-06Apparatus and method for plating semiconductor wafers
#6 | 2008-05-08Methods of proximity head brushing
#7 | 2007-09-04Method and apparatus for cleaning a substrate using megasonic power
#8 | 2007-08-07Compliant grinding wheel
#9 | 2007-08-07System and method for integrating in-situ metrology within a wafer process
#10 | 2007-07-03Distribution of energy in a high frequency resonating wafer processing system
#11 | 2007-06-19Method and apparatus for simultaneously cleaning the front side and back side of a wafer
#12 | 2007-05-31Method and apparatus for semiconductor wafer cleaning using high-frequency acoustic energy with supercritical fluid
#13 | 2007-03-20Method and apparatus for semiconductor wafer cleaning using high-frequency acoustic energy with supercritical fluid
#14 | 2007-01-30Apparatus for oscillating a head and methods for implementing the same
#15 | 2007-01-23Method and apparatus to decouple power and cavitation for megasonic cleaning applications
#16 | 2006-10-31Method and apparatus for fluid delivery to a backside of a substrate
#17 | 2006-09-19Compliant wafer chuck
#18 | 2006-08-15Methods of and apparatus for pre-planarizing a substrate
#19 | 2006-06-15Enhanced wafer cleaning method
#20 | 2006-05-16Method for performing site-specific backside particle and contamination removal
#21 | 2006-05-09Method and apparatus for megasonic cleaning with reflected acoustic waves
#22 | 2006-05-09Method and apparatus for megasonic cleaning of patterned substrates
#23 | 2006-04-27System method and apparatus for dry-in, dry-out, low defect laser dicing using proximity technology
#24 | 2006-04-11Method and apparatus for aligning and setting the axis of rotation of spindles of a multi-body system
#25 | 2006-01-24Method and apparatus of a variable height and controlled fluid flow platen in a chemical mechanical polishing system
#26 | 2005-12-20Apparatus for reducing compressed dry air usage during chemical mechanical planarization
#27 | 2005-10-11Apparatus and method for providing a signal port in a polishing pad for optical endpoint detection
#28 | 2005-09-20Subaperture chemical mechanical planarization with polishing pad conditioning
#29 | 2005-08-30Method and apparatus for fixed abrasive substrate preparation and use in a cluster CMP tool
#30 | 2005-06-28Wafer bevel edge cleaning system and apparatus
#31 | 2005-06-23Proximity brush unit apparatus and method
#32 | 2005-06-09Apparatus for controlling galvanic corrosion effects on a single-wafer cleaning system
#33 | 2005-05-31Method and apparatus for conditioning a polishing pad
#34 | 2005-03-22System and method for polishing and planarizing semiconductor wafers using reduced surface area polishing pads and variable partial pad-wafer overlapping techniques
#35 | 2005-02-22Method and apparatus for cooling a resonator of a megasonic transducer
#36 | 2005-02-22Method for controlling galvanic corrosion effects on a single-wafer cleaning system
#37 | 2005-01-25In-situ local heating using megasonic transducer resonator
3607148 ⎘