Inventor profile of:

Werner Bergbauer

City:

Windberg

Country:

Germany

Published Applications:

28

Last publication date:

2022-10-27

Top Assignees for applications by Werner Bergbauer

The entities that hold a legal rights for patent applications filed by inventor Bergbauer Werner:

Recent patent applications by Bergbauer Werner

Werner Bergbauer from Windberg, DE has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2022-10-27
US20220344532A1
Electricity

Method for producing an optoelectronic semiconductor chip and optoelectronic semiconductor chip

#2 | 2022-01-13
US20220013990A1
Electricity

Edge-emitting semiconductor laser

#3 | 2021-08-26
US20210265531A1
Electricity

Optoelectronic semiconductor body and light-emitting diode

#4 | 2021-07-08
US20210210651A1
Electricity

Method for producing an optoelectronic semiconductor chip and optoelectronic semiconductor chip

#5 | 2020-10-22
US20200335658A1
Electricity

Method for producing a nitride compound semiconductor component

#6 | 2020-07-30
US20200243716A1
Electricity

Method of producing a radiation-emitting semiconductor chip and radiation-emitting semiconductor chip

#7 | 2020-04-16
US20200119228A1
Electricity

Component having enhanced efficiency and method for production thereof

#8 | 2020-04-16
US20200119227A1
Electricity

Semiconductor layer sequence and method for producing a semiconductor layer sequence

#9 | 2019-10-24
US20190326476A1
Electricity

Semiconductor layer sequence

#10 | 2019-08-29
US20190267511A1
Electricity

Semiconductor layer sequence having pre- and post-barrier layers and quantum wells

#11 | 2019-08-08
US20190245110A1
Electricity

Method for producing an optoelectronic semiconductor chip and optoelectronic semiconductor chip

#12 | 2019-08-01
US20190237617A1
Electricity

Optoelectronic component

#13 | 2019-07-25
US20190229239A1
Electricity

Optoelectronic semiconductor body and light emitting diode

#14 | 2019-03-14
US20190081211A1
Electricity

Optoelectronic semiconductor chip

#15 | 2018-06-21
US20180175243A1
Electricity

Method for producing a nitride semiconductor component, and a nitride semiconductor component

#16 | 2017-02-23
US20170053795A1
Electricity

Method for the production of a nitride compound semiconductor layer

#17 | 2017-02-16
US20170047479A1
Electricity

Method for producing a semiconductor layer sequence

#18 | 2017-02-09
US20170040165A1
Electricity

Method for producing a layer structure as a buffer layer of a semiconductor component and layer structure as a buffer layer of a semiconductor component

#19 | 2017-01-12
US20170012165A1
Electricity

Method of producing a semiconductor layer sequence and an optoelectronic semiconductor component

#20 | 2017-01-05
US20170005223A1
Electricity

Method for producing an optoelectronic semiconductor chip and optoelectronic semiconductor chip

#21 | 2016-03-31
US20160093765A1
Electricity

Method for producing a nitride compound semiconductor device

#22 | 2015-12-17
US20150364641A1
Electricity

Semiconductor layer sequence and method for producing a semiconductor layer sequence

#23 | 2015-11-26
US20150340561A1
Electricity

Optoelectronic semiconductor chip having reduced strain between different constituent materials of the chip

#24 | 2015-08-13
US20150228858A1
Electricity

Optoelectronic component with a layer structure

#25 | 2014-11-20
US20140339591A1
Electricity

Optoelectronic semiconductor chip

#26 | 2014-09-25
US20140286369A1
Electricity

Optoelectronic component

#27 | 2013-08-29
US20130221369A1
Electricity

Optoelectric semiconductor chip

#28 | 2013-08-01
US20130193450A1
Electricity

Optoelectronic semiconductor chip and method for producing same

InventorID:

361179 ⎘