Boise, Idaho
United States
37
2019-08-15
The entities that hold a legal rights for patent applications filed by inventor Schwab Matt E.:
Matt E. Schwab from Boise, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Packaged semiconductor components having substantially rigid support members
#2 | 2019-03-14Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
#3 | 2018-07-26Packaged semiconductor components having substantially rigid support members and methods of packaging semiconductor components
#4 | 2018-02-08Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
#5 | 2016-09-01Packaged semiconductor components having substantially rigid support members and methods of packaging semiconductor components
#6 | 2015-12-17Packaged semiconductor components having substantially rigid support members and methods of packaging semiconductor components
#7 | 2015-01-22Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
#8 | 2013-08-01Packaged microdevices and methods for manufacturing packaged microdevices
#9 | 2011-09-29Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
#10 | 2011-05-05Packaged microdevices and methods for manufacturing packaged microdevices
#11 | 2010-10-07PACKAGED SEMICONDUCTOR COMPONENTS HAVING SUBSTANTIALLY RIGID SUPPORT MEMBERS AND METHODS OF PACKAGING SEMICONDUCTOR COMPONENTS
#12 | 2010-04-01Bond pad rerouting element, rerouted semiconductor devices including the rerouting element, and assemblies including the rerouted semiconductor devices
#13 | 2010-03-04Multi-chip module and methods
#14 | 2009-01-08Bond pad rerouting element, rerouted semiconductor devices including the rerouting element, and assemblies including the rerouted semiconductor devices
#15 | 2008-09-18Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
#16 | 2008-09-18Packaged semiconductor components having substantially rigid support members and methods of packaging semiconductor components
#17 | 2008-09-09Bond pad rerouting element, rerouted semiconductor devices including the rerouting element, and assemblies including the rerouted semiconductor devices
#18 | 2008-02-28Packaged microdevices and methods for manufacturing packaged microdevices
#19 | 2006-12-12Fabricating a carrier substrate by using a solder resist opening as a combination pin one indicator and fiducial
#20 | 2006-11-23Multi-chip module and methods
#21 | 2006-08-22Methods for designing bond pad rerouting elements for use in stacked semiconductor device assemblies and for assembling semiconductor devices
#22 | 2006-07-27Methods for designing bond pad rerouting elements for use in stacked semiconductor device assemblies and for assembling semiconductor devices
#23 | 2006-06-29Integrated circuit device having reduced bow and method for making same
#24 | 2006-06-01Bond pad rerouting element and stacked semiconductor device assemblies including the rerouting element
#25 | 2006-03-28Solder resist opening to define a combination pin one indicator and fiducial
#26 | 2006-03-21Method of fabricating a semiconductor device package
#27 | 2006-02-07Methods for fabricating routing elements for multichip modules
#28 | 2006-01-17Bond pad rerouting element and stacked semiconductor device assemblies including the rerouting element
#29 | 2005-07-21Routing element for use in semiconductor device assemblies
#30 | 2005-07-21Routing element for use in multi-chip modules, multi-chip modules including the routing element and methods
#31 | 2005-07-07Multi-chip module and methods
#32 | 2005-05-03Method for making an integrated circuit package having reduced bow
#33 | 2005-04-19Routing element for use in multi-chip modules, multi-chip modules including the routing element, and methods
#34 | 2005-03-15Multi-chip module and methods
#35 | 2005-02-03Integrated circuit device having reduced bow and method for making same
#36 | 2005-02-03Method of making a semiconductor device having an opening in a solder mask
#37 | 2005-01-20Method of making a semiconductor device having an opening in a solder mask
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