Austin, Texas
United States
17
2017-05-04
The entities that hold a legal rights for patent applications filed by inventor WENZEL ROBERT J.:
ROBERT J. WENZEL from Austin, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Substrate with routing
#2 | 2013-08-01Packaged integrated circuit using wire bonds
#3 | 2010-04-01Integrated circuit module with integrated passive device
#4 | 2009-06-18Semiconductor die with die pad pattern
#5 | 2008-07-10Method of packaging semiconductor devices
#6 | 2008-06-19Circuit device with at least partial packaging and method for forming
#7 | 2008-06-12Die positioning for packaged integrated circuits
#8 | 2008-03-06Method of forming crack arrest features in embedded device build-up package and package thereof
#9 | 2007-12-13Methods and apparatus for thermal management in a multi-layer embedded chip structure
#10 | 2007-12-13Methods and apparatus for a semiconductor device package with improved thermal performance
#11 | 2007-09-13Perforated embedded plane package and method
#12 | 2007-05-10Fine pitch interconnect and method of making
#13 | 2006-08-31Semiconductor device with a protected active die region and method therefor
#14 | 2006-01-19Circuit device with at least partial packaging and method for forming
#15 | 2005-11-03Semiconductor device with a protected active die region and method therefor
#16 | 2005-07-26Circuit device with at least partial packaging, exposed active surface and a voltage reference plane
#17 | 2005-01-04Circuit device with at least partial packaging and method for forming
361380 ⎘