Inventor profile of:

James E. Boyle

City:

Saratoga, California

Country:

United States

Published Applications:

15

Last publication date:

2010-05-13

Top Assignees for applications by James E. Boyle

The entities that hold a legal rights for patent applications filed by inventor Boyle James E.:

Recent patent applications by Boyle James E.

James E. Boyle from Saratoga, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2010-05-13
US20100119817A1
Electricity

Assembly of silicon parts bonded together with a silicon and silica composite

#2 | 2010-01-14
US20100009123A1
Chemistry; metallurgy

Czochralski growth of randomly oriented polysilicon and use of randomly oriented polysilicon dummy wafers

#3 | 2008-09-11
US20080220558A1
Electricity

Plasma spraying for semiconductor grade silicon

#4 | 2008-06-26
US20080152805A1
Chemistry; metallurgy

Polysilicon dummy wafers and process used therewith

#5 | 2008-03-06
US20080054106A1
Performing operations; transporting

Jet mill producing fine silicon powder

#6 | 2007-01-25
US20070020885A1
Electricity

Tube formed of bonded silicon staves

#7 | 2007-01-11
US20070006799A1
Electricity

Silicon wafer support fixture with roughended surface

#8 | 2006-11-21
US10642013
-

Silicon tube formed of bonded staves

#9 | 2006-09-28
US20060216908A1
Performing operations; transporting

Silicon parts joined by a silicon layer preferably plasma sprayed

#10 | 2006-09-28
US20060213601A1
Electricity

Adhesive of a silicon and silica composite for bonding together silicon parts

#11 | 2006-09-21
US20060211218A1
Chemistry; metallurgy

Baffle wafers and randomly oriented polycrystalline silicon used therefor

#12 | 2006-09-19
US9860392
-

Silicon fixture with roughened surface supporting wafers in chemical vapor deposition

#13 | 2006-08-01
US10670990
-

Adhesive of a silicon and silica composite particularly useful for joining silicon parts

#14 | 2006-07-11
US10602299
-

Plasma spraying for joining silicon parts

#15 | 2005-12-27
US10829641
-

Silicon fixture supporting silicon wafers during high temperature processing

InventorID:

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