Inventor profile of:

Lance A. Hicks

City:

Salem, Oregon

Country:

United States

Published Applications:

12

Last publication date:

2010-10-07

Top Assignees for applications by Lance A. Hicks

The entities that hold a legal rights for patent applications filed by inventor Hicks Lance A.:

Recent patent applications by Hicks Lance A.

Lance A. Hicks from Salem, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2010-10-07
US20100255283A1
Performing operations; transporting

Layered panel structure including self-bonded layers of thermoformable and non-thermoformable materials

#2 | 2010-10-07
US20100252195A1
Performing operations; transporting

Methodology for creating layered panel structure including self-bonded thermoformable and non-thermoformable layer materials

#3 | 2010-06-17
US20100151216A1
Performing operations; transporting

Stratified panel structure possessing interleaved, thin-high-density, thick-low-density core-structure stack arrangement

#4 | 2009-12-17
US20090308521A1
Performing operations; transporting

Compression-selective sheet-material density and thickness and methodology

#5 | 2009-12-17
US20090308007A1
Performing operations; transporting

Composite layered panel and methodology including selected regional elevated densification

#6 | 2009-08-20
US20090208724A1
Performing operations; transporting

Embedded-object, composite-material product

#7 | 2008-10-09
US20080245028A1
Performing operations; transporting

Thermoforming, with applied pressure and dimensional re-shaping, layered, composite-material structural panel

#8 | 2008-07-10
US20080166526A1
Performing operations; transporting

Formed panel structure

#9 | 2008-07-10
US20080163587A1
Fixed constructions

Composite panel structure with frame reinforcement

#10 | 2008-02-21
US20080044645A1
Performing operations; transporting

Method of making an embedded-object and composite-material product

#11 | 2008-02-07
US20080032102A1
Performing operations; transporting

Layered panel structure including self-bonded thermoformable and non-thermoformable layer materials

#12 | 2007-09-27
US20070221324A1
Performing operations; transporting

Thermoforming, with applied pressure and dimensional re-shaping, layered, composite-material structural panel

InventorID:

3628017 ⎘