Andreas MEIER

City:

Hamburg

Country:

Germany

Published Applications:

Last publication date:

2010-06-24

Top Assignees for applications by Andreas MEIER

The entities that hold a legal rights for patent applications filed by inventor MEIER Andreas:

Andreas MEIER from Hamburg, DE has applied for patents for these inventions. The list has both pending applications and granted patents:

Process for preparing a thermally reactive pressure-sensitive adhesive

Stamped Product Used to Seal Holes in a Durable Manner, in Particular in Sheet or in Plastic Pieces on Car Bodies

InventorID:

3632649 ⎘