Seiichi Mimura

City:

Tokyo

Country:

Japan

Published Applications:

Last publication date:

2010-07-01

Top Assignees for applications by Seiichi Mimura

The entities that hold a legal rights for patent applications filed by inventor Mimura Seiichi:

Seiichi Mimura from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

Multi-wire saw and method for cutting ingot

Slurry for slicing silicon ingot and method for slicing silicon ingot using the same

Multi-wire saw

InventorID:

3634716 ⎘