Windham, New Hampshire
United States
24
2024-06-27
The entities that hold a legal rights for patent applications filed by inventor Goida Thomas M.:
Thomas M. Goida from Windham, US has applied for patents for these inventions. The list has both pending applications and granted patents:
HIGH FREQUENCY DEVICE PACKAGES
#2 | 2022-06-09Low stress integrated device package
#3 | 2017-11-09Low stress integrated device packages
#4 | 2017-01-26Stress isolation features for stacked dies
#5 | 2016-11-17Integrated device die and package with stress reduction features
#6 | 2016-06-16Low stress compact device packages
#7 | 2016-05-12Pre-molded MEMS device package having conductive column coupled to leadframe and cover
#8 | 2015-06-25Integrated device die and package with stress reduction features
#9 | 2014-08-07Double-sided package
#10 | 2014-07-17Two-axis vertical mount package assembly
#11 | 2014-06-19Integrated microphone package
#12 | 2014-03-13MEMS device package with conductive shell
#13 | 2014-03-13Pre-molded MEMS device package having conductive column coupled to leadframe and cover
#14 | 2013-09-19Packaged integrated device die between an external and internal housing
#15 | 2013-08-01Microphone system with offset apertures
#16 | 2012-09-20Vertical mount package for MEMS sensors
#17 | 2012-04-12Microphone package with embedded ASIC
#18 | 2011-03-03Wafer Level Stacked Die Packaging
#19 | 2010-04-01Vertical mount package for MEMS sensors
#20 | 2009-04-23Wafer level stacked die packaging
#21 | 2008-07-31Low Cost Stacked Package
#22 | 2008-07-31Wafer level CSP packaging concept
#23 | 2008-04-17Integrated Circuit with Back Side Conductive Paths
#24 | 2007-05-17Method of fabricating an exposed die package
363790 ⎘