Timothty D. SULLIVAN

City:

Underhill, Vermont

Country:

United States

Published Applications:

Last publication date:

2010-07-01

Top Assignees for applications by Timothty D. SULLIVAN

The entities that hold a legal rights for patent applications filed by inventor SULLIVAN Timothty D.:

INTERNATIONAL BUSINESS MACHINES CORPORATION 1 ARMONK, NY United States

Recent patent applications by SULLIVAN Timothty D.

Timothty D. SULLIVAN from Underhill, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2010-07-01

US20100167522A1

Electricity

Structures and methods for improving solder bump connections in semiconductor devices

InventorID:

3638424 ⎘