Hideki Ohhashi

City:

Helsinki

Country:

Finland

Published Applications:

Last publication date:

2010-09-16

Top Assignees for applications by Hideki Ohhashi

The entities that hold a legal rights for patent applications filed by inventor Ohhashi Hideki:

Hideki Ohhashi from Helsinki, FI has applied for patents for these inventions. The list has both pending applications and granted patents:

APPARATUS COMPRISING AN ELECTRONICS MODULE AND METHOD OF ASSEMBLING APPARATUS

InventorID:

3652257 ⎘