Takako Ejiri

City:

Ibaraki

Country:

Japan

Published Applications:

Last publication date:

2010-09-30

Top Assignees for applications by Takako Ejiri

The entities that hold a legal rights for patent applications filed by inventor Ejiri Takako:

Takako Ejiri from Ibaraki, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

CIRCUIT CONNECTING MATERIAL, CONNECTION STRUCTURE OF CIRCUIT MEMBER, AND METHOD FOR MANUFACTURING CONNECTION STRUCTURE OF CIRCUIT MEMBER

Polyamide-imide resin, process for production of polyamide resin, and curable resin composition

Polyamideimide resin, adhesive agent, material for flexible substrate, flexible laminate, and flexible print wiring board

InventorID:

3655813 ⎘