John Robert Diroll

City:

Sandy, Utah

Country:

United States

Published Applications:

Last publication date:

2010-10-21

Top Assignees for applications by John Robert Diroll

The entities that hold a legal rights for patent applications filed by inventor Diroll John Robert:

John Robert Diroll from Sandy, US has applied for patents for these inventions. The list has both pending applications and granted patents:

Semiconductor die packages using thin dies and metal substrates

Semiconductor die packages using thin dies and metal substrates

InventorID:

3676213 ⎘