Yuusuke YASUDA

City:

Hitachi

Country:

Japan

Published Applications:

Last publication date:

2010-10-28

Top Assignees for applications by Yuusuke YASUDA

The entities that hold a legal rights for patent applications filed by inventor YASUDA Yuusuke:

Yuusuke YASUDA from Hitachi, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

Electrically conductive bonding material, method of bonding with the same, and semiconductor device bonded with the same

InventorID:

3678842 ⎘