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Inventor profile of:

Andreas Ostmann

City:

Berlin

Country:

Germany

Published Applications:

10

Last publication date:

2018-07-05

Top Assignees for applications by Andreas Ostmann

The entities that hold a legal rights for patent applications filed by inventor Ostmann Andreas:

Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V 4 Munich, Germany
Fraunhofer-Gesellschaft zur Forderung der angewandten Forschung e.V. 3 Munchen, Germany
Technische Universitat Berlin 1 Berlin, Germany
Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. 1 , Germany
Fraunhofer-Gesellschaft Zur Forderung Der Angewandten Forschung E.V. 1 Munich, Germany
Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e. V. 1 , Germany
TECHNISCHE UNIVERSITAET BERLIN 1 Berlin, Germany
Fraunhofer-Gesellschaft zur Foerderung der angewandt Forschung e.V. 1 Munich, Germany

Recent patent applications by Ostmann Andreas

Andreas Ostmann from Berlin, DE has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2018-07-05

US20180191064A1

Module arrangement comprising an integrated antenna and embedded components and method for manufacturing a module arrangement

#2 | 2018-07-05

US20180191062A1

Module arrangement comprising embedded components and an integrated antenna, device comprising module arrangements, and method for manufacturing

#3 | 2018-02-08

US20180040562A1

ELEKTRONISCHES MODUL UND VERFAHREN ZU SEINER HERSTELLUNG

#4 | 2013-07-25

US20130186852A1

Mechanical engineering

Device and method for producing targeted flow and current density patterns in a chemical and/or electrolytic surface treatment

#5 | 2013-01-17

US20130015572A1

Electronic assembly including an embedded electronic component

#6 | 2012-07-12

US20120176764A1

Method for generating an electronic system, method for generating a freeform surface having such a system, and electronic system and freeform surfaces having such a system

#7 | 2008-10-23

US20080257589A1

Expandable circuit carrier

#8 | 2008-03-27

US20080074856A1

Electronic Subassembly

#9 | 2008-03-13

US20080061115A1

Method for electrically connecting to a contact of a microelectronic component on a circuit board or substrate

#10 | 2006-03-14

US10698074

Method for producing encapsulated chips

InventorID:

36879 ⎘