Roger D. Weekly

Electronic module power supply

Electronic module power supply

Implementing high-speed signaling via dedicated printed circuit-board media

Crosstalk reduction between signal layers in a multilayered package by variable-width mesh plane structures

Electronic module power supply

Crosstalk reduction between signal layers in a multilayered package by variable-width mesh plane structures

Multi-layer circuit substrate fabrication method providing improved transmission line integrity and increased routing density

Implementing high-speed signaling via dedicated printed circuit-board media

System for designing substrates having reference plane voids with strip segments

Electronic module power supply

Ball grid array with improved single-ended and differential signal performance

Motherboard assembly for interconnecting and distributing signals and power

Ball grid array with improved single-ended and differential signal performance

Circuit manufacturing and design techniques for reference plane voids with strip segment

Circuit manufacturing and design techniques for reference plane voids with strip segment

Crosstalk reduction between signal layers in a multilayered package by variable-width mesh plane structures

System and method for multi-application socket

Implementing high-speed signaling via dedicated printed circuit-board media

Method of attaching an electronic module power supply

System and method for integrated circuit module tamperproof mode personalization

Ball grid array with improved single-ended and differential signal performance

Testing an optical fiber connection

Structure for enhancing reference return current conduction

Motherboard assembly for interconnecting and distributing signals and power

Circuit manufacturing and design techniques for reference plane voids with strip segment

Enhanced thermal management for improved module reliability

Tracking thermal mini-cycle stress

Multi-layer circuit substrate fabrication and design methods providing improved transmission line integrity and increased routing density

Auto-router performing simultaneous placement of signal and return paths

Reference plane voids with strip segment for improving transmission line integrity over vias

Statistical switched capacitor droop sensor for application in power distribution noise mitigation

Application of multiple voltage droop detection

Application of multiple voltage droop detection and instruction throttling instances with customized thresholds across a semiconductor chip

Method for detecting noise events in systems with time variable operating points

Design method and system for minimizing blind via current loops

System and method for electronic device development

System and method for power domain optimization

Power delivery analysis and design

Apparatus for crack prevention in integrated circuit packages

Multi-layer circuit substrate and method having improved transmission line integrity and increased routing density

System and Method of Integrated Circuit Control for in Situ Impedance Measurement

Ceramic package in which far end noise is reduced using capacitive cancellation by offset wiring

Ceramic Package in Which Far End Noise is Reduced Using Capacitive Cancellation by Offset Wiring

Method for detecting noise events in systems with time variable operating points

Mitigate power supply noise response by throttling execution units based upon voltage sensing

System DC Analysis Methodology

Method and computer program product for designing power distribution system in a circuit

Apparatus and method for selectively monitoring multiple voltages in an IC or other electronic chip

Fabricating substrates having low inductance via arrangements

Apparatus and method for far end noise reduction using capacitive cancellation by offset wiring

Triangular assignment of pins used for diagonal interconnections between diagonal chips in a multi-chip module

Routing for multilayer ceramic substrates to reduce excessive via depth