Inventor profile of:

Michael J. Shapiro

City:

Austin, Texas

Country:

United States

Published Applications:

38

Last publication date:

2020-07-23

Top Assignees for applications by Michael J. Shapiro

The entities that hold a legal rights for patent applications filed by inventor Shapiro Michael J.:

Recent patent applications by Shapiro Michael J.

Michael J. Shapiro from Austin, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2020-07-23
US20200233909A1
Physics

System, method and computer program product for data transfer management

#2 | 2019-01-31
US20190037718A1
Electricity

Dust guard structure

#3 | 2018-08-23
US20180242467A1
Electricity

Dust guard structure

#4 | 2018-06-19
US15722030
Electricity

Dust guard structure

#5 | 2018-06-14
US20180165377A1
Physics

System, method and computer program product for data transfer management

#6 | 2017-08-10
US20170229362A1
Electricity

Corrosion resistant chip sidewall connection with crackstop and hermetic seal

#7 | 2017-07-06
US20170194265A1
Electricity

Electrical connection around a crackstop structure

#8 | 2017-03-16
US20170075690A1
Physics

Multicore processor and method of use that configures core functions based on executing instructions

#9 | 2015-12-24
US20150371764A1
Electricity

NESTED HELICAL INDUCTOR

#10 | 2015-12-24
US20150371763A1
Electricity

NESTED-HELICAL TRANSFORMER

#11 | 2015-04-23
US20150113495A1
Physics

Structure for logic circuit and serializer-deserializer stack

#12 | 2015-04-23
US20150109739A1
Electricity

Structure for logic circuit and serializer-deserializer stack

#13 | 2013-12-26
US20130344675A1
Electricity

Integrated decoupling capacitor employing conductive through-substrate vias

#14 | 2013-11-21
US20130307656A1
Electricity

Stacked through-silicon via (TSV) transformer structure

#15 | 2013-05-09
US20130113448A1
Electricity

Coil inductor for on-chip or on-chip stack

#16 | 2013-01-17
US20130015579A1
Electricity

Solder ball contact susceptible to lower stress

#17 | 2012-11-22
US20120292779A1
Electricity

Semiconductor structure having offset passivation to reduce electromigration

#18 | 2012-10-11
US20120256313A1
Electricity

Solder ball contact susceptible to lower stress

#19 | 2012-01-26
US20120020042A1
Physics

Noise suppressor for semiconductor packages

#20 | 2012-01-05
US20120002812A1
Electricity

Data and control encryption

#21 | 2011-12-01
US20110291279A1
Electricity

Semiconductor article having a through silicon via and guard ring

#22 | 2011-11-24
US20110289270A1
Physics

System, method and computer program product for data transfer management

#23 | 2011-05-12
US20110108948A1
Electricity

Integrated decoupling capacitor employing conductive through-substrate vias

#24 | 2010-06-17
US20100153956A1
Physics

Multicore processor and method of use that configures core functions based on executing instructions

#25 | 2010-06-17
US20100153700A1
Physics

Configuring plural cores to perform an instruction having a multi-core characteristic

#26 | 2009-07-09
US20090177445A1
Physics

Structure for an apparatus for monitoring and controlling heat generation in a multi-core processor

#27 | 2009-06-25
US20090164812A1
Physics

Dynamic processor reconfiguration for low power without reducing performance based on workload execution characteristics

#28 | 2009-05-28
US20090138660A1
Physics

Power-aware line intervention for a multiprocessor snoop coherency protocol

#29 | 2009-05-28
US20090138220A1
Physics

Power-aware line intervention for a multiprocessor directory-based coherency protocol

#30 | 2008-10-16
US20080252308A1
Physics

Power grid structure to optimize performance of a multiple core processor

#31 | 2008-09-25
US20080234955A1
Physics

Uniform power density across processor cores at burn-in

#32 | 2008-07-24
US20080178127A1
Physics

Silicon Multiple Core or Redundant Unit Optimization Tool

#33 | 2008-06-19
US20080142959A1
Electricity

Method and structure for optimizing yield of 3-D chip manufacture

#34 | 2008-05-29
US20080127192A1
Physics

Method and System for Using Multiple-Core Integrated Circuits

#35 | 2008-05-29
US20080126748A1
Physics

Multiple-Core Processor

#36 | 2008-01-17
US20080012583A1
Physics

Power grid structure to optimize performance of a multiple core processor

#37 | 2007-09-11
US11426646
-

Apparatus and method for customized burn-in of cores on a multicore microprocessor integrated circuit chip

#38 | 2007-04-12
US20070080448A1
Electricity

Method and structure for optimizing yield of 3-D chip manufacture

InventorID:

36891 ⎘