William T. CHEN

City:

Endicott, New York

Country:

United States

Published Applications:

Last publication date:

2010-11-18

Top Assignees for applications by William T. CHEN

The entities that hold a legal rights for patent applications filed by inventor CHEN William T.:

William T. CHEN from Endicott, US has applied for patents for these inventions. The list has both pending applications and granted patents:

Substrate having single patterned metal layer, and package applied with the substrate , and methods of manufacturing of the substrate and package

Method and apparatus for forming a metallic feature on a substrate

Method and apparatus for forming a metallic feature on a substrate

Placement of sacrificial solder balls underneath the PBGA substrate

Method of forming selective electroless plating on polymer surfaces

InventorID:

3692992 ⎘